H3C Hong Kong and Macao Core Partners Visit Hangzhou to Explore New Digital Innovation and AI Development Landscape
From July 16 to 17, the core partner delegation of H3C's Hong Kong and Macao region visited H3C's headquarters in Hangzhou for an in-depth exchange. The delegation toured the Innovation Experience Center, Future Factory, and Chip-Module Community, discussing opportunities in digitalization and AI development and deepening strategic cooperation.
New Unigroup Group Successfully Held Its First Innovation Summit, Leading the Intelligent Technology Industry into a New Era of Innovation
New Unigroup Group's inaugural innovation summit, themed 'Intelligent Chain Symbiosis · Gather Together to Create the Future', unveiled the New Unigroup full portfolio and six major technological innovations. The company also established the Emerging Innovation Alliance (EIA), launched two industrial funds, and signed multiple strategic cooperation agreements, showcasing its full industry chain layout and leading capabilities in AI, chips, and ICT.
Xi'an Mayor Ye Niuping Visits Semiconductor and Photonics Enterprises
Xi'an Mayor Ye Niuping emphasized a dual-wheel strategy of technology services and manufacturing to accelerate the release of the city's semiconductor and photonics industry potential. During his visit to Unigroup Guoxin and other enterprises, he acknowledged their technical expertise in memory chips and encouraged further breakthroughs in cutting-edge technologies and capacity expansion.
IC China 2025: Unigroup Guoxin Showcases Multiple Storage Innovation Achievements
Unigroup Guoxin showcased its LPDDR4(X) particles, DDR5 VLP-RDIMM modules, and full-process design services at IC China 2025, highlighting its leading storage technology capabilities for smart cars and data centers.