Covering mobile communications, security, high reliability, automotive electronics, storage, and computing power.
Digital Infrastructure · Cloud Services · Smart Terminals · Smart Applications
Focusing on AI infrastructure, on-device AI, AI tools, and embodied intelligence.
Mobile communication and IoT chips, intelligent security chips, FPGA and special integrated circuits, and memory chips — led by UNISOC, Unigroup Guoxin, and Pango Microsystems.
Networks and connectivity, computing and servers, cloud and software platforms, and intelligent terminals — led by H3C and Unisplendour Corporation.
AI infrastructure, edge intelligence, industry agents, and frontier exploration — bringing large-model capabilities into real industry scenarios.