AI Applications

Three Pillar Industries

Spanning the Entire Value Chain of Semiconductor Chips, ICT Communication Infrastructure, and AI+ Applications

Covering the widest range of chip categories with China's largest overall sales volume; core technologies built on decades of accumulation, extensively validated, secure and reliable.

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ICT Digitial Infrastructure

We are building an all-encompassing AI infrastructure system that covers cloud, networking, security, computing power, storage, and end devices, delivering full-stack security and autonomous controllability from the hardware layer up to the application layer

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AI + Applications

We have established a three-layer capability foundation — base chips, edge AI chips, and AI tools — extending into scenarios such as intelligent computing centers, the low-altitude economy, aerospace, the marine economy, and embodied intelligence

Comprehensive R&D · Extensive Market · Advanced Manufacturing

Three Key Initiatives Empowering Innovative Development of Member Companies

Comprehensive R&D

Focusing on four core domains: chip R&D integrating computing power, connectivity, and storage; edge AI chips; AI tools; and full-stack integrated R&D oriented toward AGI. Through the Tsinghua Unigroup R&D system and platform, these capabilities are made accessible to empower all Member Companies, enabling each industrial entity to leverage the Unigroup's accumulated technological expertise in addressing market demands.

Extensive Market

Focusing on six cutting-edge sectors—Space, Land, Marine, Life Sciences, Micro-scale Technologies, and Advanced Materials—the Tsinghua Unigroup coordinates its brand, channel, and customer resources to integrate the capabilities of its chip, ICT, and AI subsidiaries into comprehensive, customer-oriented full-stack solutions. This synergistic approach enables Member Companies to collectively expand market opportunities rather than operating in isolation.

Advanced Manufacturing

Tsinghua Unigroup has made forward-looking strategic deployments across four key domains: two-dimensional materials, next-generation memory, advanced packaging, and specialty process technologies. Leveraging Group-level manufacturing capabilities, it establishes a robust industrial foundation for all Member Companies in the post-Moore era.

Five Core Capabilities

Semiconductor Industry Chain Support Capabilities

Establishing foundational support for the development of the Chip Business by focusing on key segments including equipment, materials, industrial software, packaging and testing, and specialty processes.

Chip Design and Core Component Capabilities

Encompassing key sectors including mobile communications, security, high-reliability applications, automotive electronics, memory, and computing power, the Company provides critical chip support for the intelligent technology industry.

ICT Digital Infrastructure Capabilities

Leveraging products and solutions encompassing networking, servers, storage, and cloud infrastructure to underpin the connectivity, hosting, and operation of the digital and intelligent worlds.

Intelligent Computing and Cloud Service Capabilities

In the era of artificial intelligence, we provide intelligent computing infrastructure, cloud platform services, and computing power scheduling capabilities to support model training, inference, and industry-specific intelligent applications.

Digitalization and AI Solution Capabilities

Providing digital and intelligent transformation and intelligent upgrade solutions tailored to specific scenarios for government, enterprise, and industry clients.