Home

News Center

View All News →

2026-05-15

Emerging Innovation Alliance (EIA) Launched & Industry Funds Established

2026-07-09

H3C and Cyber University of Uzbekistan Partner to Advance Digital Education and Cybersecurity Innovation

2026-05-19

Tsinghua Unigroup and BAIC Group Sign Strategic Cooperation Agreement, Jointly Building a New Ecosystem for the Intelligent Vehicle Industry

2026-03-09

Tsinghua Unigroup and Industrial Bank Sign Comprehensive Strategic Cooperation Agreement

Three Pillar Industries

Spanning the Entire Value Chain of Semiconductor Chips, ICT Communication Infrastructure, and AI+ Applications

01

Semiconductor Chip

Covering the widest range of chip categories with China's largest overall sales volume; core technologies built on decades of accumulation, extensively validated, secure and reliable.

01

ICT Digitial Infrastructure

We are building an all-encompassing AI infrastructure system that covers cloud, networking, security, computing power, storage, and end devices, delivering full-stack security and autonomous controllability from the hardware layer up to the application layer

01

AI + Applications

We have established a three-layer capability foundation — base chips, edge AI chips, and AI tools — extending into scenarios such as intelligent computing centers, the low-altitude economy, aerospace, the marine economy, and embodied intelligence

View Business Layout →

Major National Projects

Tsinghua Unigroup provides comprehensive support for major national projects, including core chips, network infrastructure, cloud services, and digital solutions.

Major National Astronomical Exploration Projects

Providing ground application systems for major scientific research tasks such as the world largest radio telescope "China FAST", the first Mars exploration mission "Tianwen-1", and the lunar exploration mission "Chang'e-5", to support network, data exchange, and cyber security for these tasks. Using digital technology to fully support national astronomical research and innovative exploration, realizing the great dreams of humanity.

Beijing Winter Olympics

Providing screen chips, comprehensive network and intelligent application solutions for the Beijing Winter Olympics, including chips for the super-sized wall-to-ground icefall screen at the opening ceremony, the Winter Olympics dedicated network infrastructure, the urban rail cloud platform for the Winter Olympics branches, 8K live broadcasting by China Central Radio and Television Station, and smart services in venues. These key projects ensure the successful completion of the events, painting a panoramic picture of winter Olympic technology with the brush of technology.

Beijing Daxing International Airport

Providing IT infrastructure and network engineering construction for the new airport and offering computing and storage resources for the airport's private cloud and group cloud. These resources support the core business systems of the new airport and meet data disaster recovery requirements for the efficient and stable operation of the new airport.

China-Made Large Aircraft C919

Developing the core chip for the domestically produced large aircraft C919 - an aviation full-duplex switched Ethernet switch chip. This chip is used for the onboard local area network, overcoming key core technology challenges in the field of airborne electronic systems. It is the only domestically produced chip that has passed the highest level of airworthiness certification (DAL A), providing strong technological support for China's domestically controlled and verifiable test flights of large aircraft.

National Railway Trunk Line Video Enhancement Project

Forging a 'Far-Seeing Eye' and 'Data Shield' for the Video Enhancement Project of National Railway Trunk Lines, this initiative leverages a cloud-based storage architecture and ultra-high-speed read/write technology to overcome the persistent challenges of limited storage capacity and inefficient data retrieval in conventional railway video systems. Achieving an overall deployment cost reduction exceeding 30%, it drives the transformation of the railway video management system toward a cloud-native, highly efficient, and independently controllable paradigm.

Electronic Certificates such as Identity Cards, Social Security Cards, and Official Passports

Developing a dedicated chip for the 2nd-generation national identity card, with a market share of 25%. Introducing the 3rd-generation social security card technology solution, achieving the integration of social security cards, bank cards, transportation cards, health cards, residence permits, and more. Undertaking chip research and development tasks for national-level certificate and credential projects such as electronic tickets for the Beijing Olympics and seafarer certificates, contributing to the nation's informatization and digitization efforts.

Tsinghua Unigroup: Intelligent Future

Originating from Tsinghua University, Tsinghua Unigroup traces its roots to the Tsinghua University Science and Technology Development General Corporation established in 1988, and has long been deeply engaged in the technology sector. Revitalized in 2022, the Group has evolved into a globally competitive intelligent technology industry group. In response to the new cycle of AI-driven industrial transformation, Tsinghua Unigroup focuses on three core pillars: IC, ICT digital infrastructure, and AI. It is committed to leveraging hard-tech innovation and industrialization capabilities to build a world-leading full-chain intelligent technology ecosystem, making the world more intelligent, more open-minded,more fair and more splendor.

View Group Overview →